According to the requirements of technique and performance of encapsulation adhesive tape of automatic product line of IC card,the dispensation system of adhesive,assistant,filling and so on are investigeted,and then carried out the coating experiment,with the residual paper which its surface tension matches with adhesive's as substrute material.
本文依据IC卡自动生产线对其芯片封装胶带技术性能与封装工艺要求,通过对胶粘剂、助剂、填料等组成的配方体系进行研究,并进行涂布工艺实验,选取表面张力与胶粘剂混合液表面张力相匹配的防粘纸作为带基。
Polyurethane elastomers used for packing rolls were synthesized from PTMG, toluene diisocyanate,methylene bis-ortho-chloroaniline(MOCA).
根据包装胶辊的使用要求选择合适的聚氨酯原材料 ,考察了合成预聚体中游离NCO含量、后硫化条件、粘合工艺对材料物理机械性能的影
