Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist;
后烘温度对SU-8光刻胶热溶胀性及内应力的影响
Basing on the fabrication of micro mold insert by existing UV-LIGA technique,regularity of SU-8 thermal swelling was simulatively analyzed with ANSYS.
对SU-8胶的热溶胀效应及其机理进行了研究,在现有微模具的UV-LIGA工艺的基础上,利用AN-SYS对SU-8胶的热溶胀性规律进行了仿真分析。
Preparation of submicron zinc borate with low hydrous content by solvothermal treatment;
溶剂热改性法制备亚微米级低水硼酸锌
Copyright © 2022-2025 字海网 zi.yyxxoo.com All Rights Reserved 赣ICP备16001187号
字海网是专业的汉语在线工具集,提供权威的汉语字典、词典、成语、古诗词及英语词典查询服务,致力于传承和弘扬中华语言文化。合作与反馈请联系QQ:2830130449。
本站内容来源网络,如涉及版权或表述问题,请及时联系QQ:2830130449。